TIF080 AB-11S High Thermal Conductive Two Component 8.0W/MK Thermal Gel For Telecommunications
TIFTM080AB-11S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
< Good thermal conductive: 8.0W/mK
< Two-part formulation for easy storage
< Excellent low and high temperature mechanical and chemical stability
< Ultra-conforming low-stress interface application
< Ambient or accelerated cure schedules
< Optimized shear thinning characteristics for ease of dispensing
Applications
< Computer and peripherals
< Telecommunications
< Automotive electronics
< Thermally conductive vibrationdampening
< Heat sink and any heatgenerating semicondutor
| Typical Properties of TIF®080 AB-11S Series |
| Typical Uncured Material |
| Property | Numerical | Test Method |
| Color/Part A | White | Visual |
| Color/Part B | Gray | Visual |
| Fiow Rate (g/min) @75psi | 4.5 | ****** |
| Density | 3.4g/cm³ | ASTM D792 |
| Bond line thickness(mm) | 0.2 | ASTM D374 |
| Mix Ratio | 1:1 | ****** |
| Shelf Life@25℃ | 6 months | ****** |
| Cure Schedule |
| Pot Life @25℃ | 30 min | ****** |
| Cure @25℃ | 120 min | ****** |
| Cure @100℃ | 30 min | ****** |
| Cure Properties |
| Color | Gray | Visual |
| Hardness | 45 shore00 | ASTM D2240 |
| Continuous Use Temp | -45~200℃ | ****** |
| Voltage Strength | ≥4000 V/mm | ASTM D149 |
| Volume Resistivity | ＞1.0*1012 Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity | 8.0W/mK | ASTM D5470 |
| Thermal impedance@10psi (℃-in2/W) | 0.72 | ASTM D5470 |
| Thermal impedance@50psi (℃-in2/W) | 0.60 | ASTM D5470 |
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
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TIF080 AB-11S High Thermal Conductive Two Component 8.0W/MK Thermal Gel For Telecommunications Images
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